秒速赛车开奖官方同步
Flip Chip, also known as Direct Chip Attach (DCA), is a method of interconnecting IC chips with solder balls/ bumps that have been deposited onto the top-side IC chip pads to a substrate. The IC chip is flipped over during assembly so that its top side faces down. Solder balls/ bumps are eutectic (Sn63Pb37) or lead free (SAC305).
秒速赛车预测软件下载
| Ball/Bump Pitch um (mil) |
Ball/ Bump Size um |
PCB Pad Size um |
PCB Pad Size Variation |
| 300um (12mil) | 150-165um | 165um | 150-165um |
| 250um (10mil) | 125-140um | 140um | 125-140um |
| 220um (9mil) | 110-120um | 120um | 110-120um |
| 200um (8mil) | 100-110um | 110um | 100-110um |
| 180um (7mil) | 90-100um | 100um | 90-100um |
| 150um (6mil) | 75-85um | 85um | 75-85um |
秒速赛车在线投注
| Description | Standard Production |
| Flip-Chip Ball or Bump | Eutectic Sn63Pb37 or Lead-free SAC305 |
| Flip-Chip Attach | Gel Flux clean or no clean |
| Underfill | Namics 8437-2 |
| Max. Die Size | 1”/ 25mm² |
| Min. Die Size | 20 mils²/ 500um² |
| Die Thickness | 0.15mm to 1mm (6-40mils) |
| Flip-Chip to PCB Edge | 20 mil/ 500um |
| F/C to SMT Component | 20 mil/ 500um |
| Flip-Chip Pick from: | Waffle Pack 2”x2” and 4”x4” |
| Flip-Chip place to: | Rigid, Flex, Rigid-Flex PCB or Ceramic substrate |
| Visual Inspection | 25-160 kV XRAY, <1um detail detectability |
