秒速赛车玩法
秒速赛车开奖最快
| Document | Die Size | Die-Attach Pad Size |
| Comply with MIL-STD-883 |
L x W | D/A Pad Length ≥ L+ 500 um (20mil) D/A Pad Width ≥ W + 500 um (20mil) |
| Do not comply with MIL-STD-883 |
L x W | D/A Pad Length ≥ L+ 250 um (10mil) D/A Pad Width ≥ W + 250 um (10mil) |
秒速赛车开奖走势
| Description | Standard Production |
| XY Placement | +/-7um to +/-15um (0.3-0.6 mils) accuracy |
| Theta Placement | +/-0.15° accuracy |
| Max. Die Tilt | <1.0mm die size = 12um, ≥1.0mm die size = 25um |
| Die Attach Fiducial | 3x Round pad, ≥300um (12 mils), typical 500um |
| Bond Line Thickness | BLT = 25-50um (1-2mil) |
| Die Size | 200um² to 50mm² (8 mils² to 2”) |
| Die Thickness | 100um to 750um (4mils to 30mils) |
| Die pick from: | Wafer, Waffle Pack or Gel-Pak |
| Die place to: | Rigid, Flex, Rigid-Flex PCB or Ceramic substrate |
| Visual Inspection | 30x to 60x magnification |
秒速赛车开奖号码记录
| Description | Standard Production |
| XY Placement | +/-50um to +/-100um (2-4 mils) accuracy |
| Theta Placement | +/-5° accuracy |
| Max. Die Tilt | <1.0mm die size = 25um, ≥1.0mm die size = 50um |
| Bond Line Thickness | BLT = 25-50um (1-2mil) |
| Die Size | 200um² to 50mm² (8 mils² to 2”) |
| Die Thickness | 100um to 750um (4mils to 30mils) |
| Die pick from: | Wafer (4”-12”), Waffle Pack or Gel-Pak |
| Die place to: | Rigid, Flex, Rigid-Flex PCB or Ceramic substrate |
| Visual Inspection | 30x to 60x magnification |
