It is difficult in today’s market to identify a U.S. Electronics Manufacturing Services company with a strong Engineering team that offers both Complex PCB Assembly and Advanced Microelectronics at one location.
- SMT and Micro-SMT Assembly.
- Flip Chip & Underfill Assembly.
- PCB, Flex and Ceramic Substrates.
- Precision Die Attach and Multi-Chip.
- Fine Pitch Wire Bonding and Ribbon Bonding.
- Glob Top, Dam & Fill, Underfill, UV.
- An extension of your R&D Engineering Team.
- Multiple Assembly Processes and Materials.
- Custom Tooling and Manufacturing Flows.
- 3D High-Res AOI and 160Kv XRAY Inspection.
- Metrology and 3D High Accuracy Digital Microscope.
- Bond Test: Wire Bond, Die Shear and Ball Shear.
- Control of Documents and Records.
- Manufacturing Process Instructions (MPI).
- Employee Training: ISO, IPC, Microelectronics.